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ENME 690

Mechanical Fundamentals of Electronic Systems

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Prof: Abhijit Dasgupta / Fall 2022

Apr 18, 2023

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It is a good course to put yourself into the reliability engineering side of electronic packaging. Dr. Dasgupta explains very well about the procedures involved in packaging a chip, types of solder *****, and the stresses associated with it. You will also be doing a sem long project with a group on identifying packaging and materials in a real electronic device.

Delivery: In personGrade: A-Workload: ModerateTextbook Use: No
Assignment HeavyProject HeavyExam Heavy

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